GENEVA, March 3 -- GLOBALWAFERS CO., LTD. (No. 8, Industrial East Road 2Science-Based Industrial ParkHsinchu City, 30075), BHAGAVAT, Sumeet (c/o MEMC LLC501 Pearl DriveSt. Peters, Missouri 63376) filed a patent application (PCT/US2025/042557) for "SYSTEMS AND METHODS FOR ENHANCED WAFER MANUFACTURING" on Aug 19, 2025. With publication no. WO/2026/043867, the details related to the patent application was published on Feb 26, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): LIN, Tsung Chieh (No. 2 Creation RoadHsinchu Science-Based ParkHsinchu, 30077)
Abstract: A computer device is provided. Th...