GENEVA, July 6 -- SEKISUI CHEMICAL CO., LTD. filed a patent application (JP2025/043959) for “GAP PARTICLES FOR SOLDER PASTE, SOLDER PASTE, AND CONNECTION STRUCTURE”. With publication no. WO/2026/141053, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01B 1/22
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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