GENEVA, Dec. 16 -- FURUYA METAL CO., LTD. (37-5, Minami Otsuka 2-chome, Toshima-ku, Tokyo1700005), 株式会社フルヤ金属 (東京都豊島区南大塚二丁目３７番５号) filed a patent application (PCT/JP2025/019892) for "SILVER ALLOY, SPUTTERING TARGET MATERIAL THEREOF, AND THIN FILM THEREOF" on Jun 02, 2025. With publication no. WO/2025/254067, the details related to the patent application was published on Dec 11, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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