International Patent: FULLY ISOLATED SUPER VIA IN WAFER STACKING STRUCTURE

GENEVA, Sept. 18 -- APPLIED MATERIALS, INC. filed a patent application (US2025/049995) for “FULLY ISOLATED SUPER VIA IN WAFER STACKING STRUCTURE”. With publication no. WO/2026/187403, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 70/40

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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