INTERNATIONAL PATENT: FUJIFILM CORPORATION, 富士フイルム株式会社 FILES APPLICATION FOR "RESIN COMPOSITION, CURED OBJECT, MULTILAYER OBJECT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING MULTILAYER OBJECT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE"

GENEVA, Feb. 3 -- FUJIFILM CORPORATION (26-30, Nishiazabu 2-chome, Minato-ku, Tokyo1068620), 富士フイルム株式会社 (東京都港区西麻布２丁目２６番３０号) filed a patent application (PCT/JP2025/025662) for "RESIN COMPOSITION, CURED OBJECT, MULTILAYER OBJECT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING MULTILAYER OBJECT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE" on Jul 18, 2025. With publication no. WO/2026/023553, the details related to the patent application was published on Jan 29, 2026.

Notably, the patent application was submitted under the I...