GENEVA, March 10 -- FUJIFILM CORPORATION (26-30, Nishiazabu 2-chome, Minato-ku, Tokyo1068620), 富士フイルム株式会社 (東京都港区西麻布２丁目２６番３０号) filed a patent application (PCT/JP2025/029712) for "METHOD FOR MANUFACTURING BONDED BODY, METHOD FOR MANUFACTURING SEMICONDUCTOR MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR MEMBER, AND RESIN COMPOSITION" on Aug 25, 2025. With publication no. WO/2026/048734, the details related to the patent application was published on Mar 05, 2026.
Notably, the patent application was submitted under the International Patent ...