GENEVA, May 5 -- FOUNDATION OF SOONGSIL UNIVERSITY-INDUSTRY COOPERATION (369 Sangdo-roDongjak-guSeoul 06978), 숭실대학교산학협력단 (서울특별시동작구상도로 369) filed a patent application (PCT/KR2025/008199) for "METHOD AND DEVICE FOR PREDICTING THREE-DIMENSIONAL STRESS-STRAIN CURVE BY USING ULTRASONIC WAVE" on Jun 13, 2025. With publication no. WO/2026/089181, the details related to the patent application was published on Apr 30, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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