International Patent: FOLDABLE AND MODULAR OPTICAL INTERCONNECT MODULES FOR HIGH-DENSITY OPTICAL INTERCONNECTS

GENEVA, July 18 -- SAMTEC, INC. filed a patent application (US2025/061425) for “FOLDABLE AND MODULAR OPTICAL INTERCONNECT MODULES FOR HIGH-DENSITY OPTICAL INTERCONNECTS”. With publication no. WO/2026/151623, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01R 12/75

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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