GENEVA, Sept. 24 -- MITSUBISHI MATERIALS CORPORATION filed a patent application (JP2026/010398) for “FLUX COMPOSITION FOR WATER-SOLUBLE SOLDER PASTE, AND WATER-SOLUBLE SOLDER PASTE”. With publication no. WO/2026/197312, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B23K 35/363
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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