GENEVA, Aug. 7 -- HAMAMATSU PHOTONICS K.K. filed a patent application (JP2025/036225) for “FILM THICKNESS MEASUREMENT DEVICE AND FILM THICKNESS MEASUREMENT METHOD”. With publication no. WO/2026/163523, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G01B 11/06
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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