GENEVA, July 18 -- BYD COMPANY LIMITED filed a patent application (CN2026/071182) for “FILM LAYER STRUCTURE, HOUSING, ELECTRONIC DEVICE AND PREPARATION METHOD FOR FILM LAYER STRUCTURE”. With publication no. WO/2026/149441, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C23C 14/06
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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