GENEVA, Nov. 6 -- DIODES SHANGHAI CO., LTD. filed a patent application (CN2025/099277) for “FILM LAMINATING MACHINE AND FILM LAMINATING SYSTEM”. With publication no. WO/2026/227548, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B32B 37/06
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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