GENEVA, Aug. 7 -- KOKUSAI ELECTRIC CORPORATION filed a patent application (JP2025/034055) for “FILM FORMATION REACTION ANALYSIS METHOD, SUBSTRATE PROCESSING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, PROGRAM, SUBSTRATE PROCESSING DEVICE, AND FILM FORMATION REACTION ANALYSIS SYSTEM”. With publication no. WO/2026/163513, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 21/318
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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