GENEVA, Sept. 7 -- RESONAC CORPORATION filed a patent application (JP2026/006877) for “FILM ADHESIVE FOR SEMICONDUCTORS AND METHOD FOR MANUFACTURING SAME, ADHESIVE TAPE AND METHOD FOR MANUFACTURING SAME, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING COATING LIQUID”. With publication no. WO/2026/182070, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 72/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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