GENEVA, Jan. 17 -- FIGL, Erhard (Geiselbergstrasse 34-36/1a/911110 Wien) filed a patent application (PCT/AT2025/060274) for "HEAT PUMP" on Jul 08, 2025. With publication no. WO/2026/011200, the details related to the patent application was published on Jan 15, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): FIGL, Erhard (Geiselbergstrasse 34-36/1a/911110 Wien)
Abstract: A heat pump (HEWP) for generating heat, the heat pump (HEWP) having a refrigerant circuit (K) in which a refrigerant is conducted cyclically through a first heat exchanger (1), a compression device (4), a second heat exchang...