GENEVA, Aug. 14 -- CARL ZEISS SMT GMBH filed a patent application (EP2026/051760) for “FAST 3D VOLUME INSPECTION OF SEMICONDUCTOR WAFERS WITH INCREASED DEPTH RESOLUTION”. With publication no. WO/2026/166792, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10P 74/20
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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