GENEVA, Sept. 18 -- KANEKA CORPORATION filed a patent application (JP2026/008767) for “EXPANDABLE STYRENE/METHYL METHACRYLATE-BASED RESIN PARTICLES, FOAMED STYRENE/METHYL METHACRYLATE-BASED PARTICLES, FOAMED STYRENE/METHYL METHACRYLATE-BASED MOLDED ARTICLE, AND LOST PATTERN”. With publication no. WO/2026/186898, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08J 9/04
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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