International Patent: EVAPORATION DEVICE AND SUBSTRATE ELECTROPLATING APPARATUS

GENEVA, Oct. 1 -- ACM RESEARCH (SHANGHAI) , INC. filed a patent application (CN2025/146052) for “EVAPORATION DEVICE AND SUBSTRATE ELECTROPLATING APPARATUS”. With publication no. WO/2026/188952, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C25D 17/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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