GENEVA, Oct. 9 -- SHANGHAI HIUV NEW MATERIALS CO., LTD. filed a patent application (CN2025/087153) for “EVA RESIN MOLECULAR STRUCTURE”. With publication no. WO/2026/207858, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08F 267/06
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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