GENEVA, Oct. 22 -- MITSUBISHI GAS CHEMICAL COMPANY, INC. filed a patent application (JP2026/010013) for “EPOXY RESIN CURING AGENT COMPOSITION, EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF, ARTICLE HAVING SAID CURED PRODUCT, AND METHOD FOR PRODUCING ARTICLE”. With publication no. WO/2026/220773, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08G 59/40
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....