GENEVA, Sept. 24 -- ASAHI KASEI KABUSHIKI KAISHA filed a patent application (JP2025/045192) for “EPOXY RESIN COMPOSITION, SEALING MATERIAL, CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE MATERIAL, INSULATING MATERIAL, ADHESIVE FOR CAMERA MODULE, STRUCTURAL ADHESIVE, MATRIX RESIN FOR FIBER-REINFORCED PLASTIC, IMPREGNATION FIXING AGENT, INTERLAYER INSULATING FILM, FILM-TYPE SOLDER RESIST, SEALING SHEET, CONDUCTIVE FILM, ANISOTROPIC CONDUCTIVE FILM, AND THERMALLY CONDUCTIVE FILM”. With publication no. WO/2026/196745, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08G 59/50
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which...