INTERNATIONAL PATENT: EO TECHNICS CO.,LTD., 주식회사 이오테크닉스 FILES APPLICATION FOR "METHOD FOR DIVIDING PROCESSING OBJECT INCLUDING SUBSTRATE LAYER AND AT LEAST ONE MATERIAL LAYER"

GENEVA, Feb. 3 -- EO TECHNICS CO.,LTD. (91, Dongpyeon-ro, Dongan-gu,Anyang-si,Gyeonggi-do 13930), 주식회사 이오테크닉스 (경기도안양시동안구 동편로 91) filed a patent application (PCT/KR2025/008431) for "METHOD FOR DIVIDING PROCESSING OBJECT INCLUDING SUBSTRATE LAYER AND AT LEAST ONE MATERIAL LAYER" on Jun 18, 2025. With publication no. WO/2026/023871, the details related to the patent application was published on Jan 29, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Invent...