International Patent: ENDODONTIC INSTRUMENT WITH ENLARGED CHIP SPACE AND REDUCED TORQUE STRENGTH

GENEVA, Sept. 24 -- JOHNSON, William B. filed a patent application (US2026/019678) for “ENDODONTIC INSTRUMENT WITH ENLARGED CHIP SPACE AND REDUCED TORQUE STRENGTH”. With publication no. WO/2026/198624, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: A61C 5/42

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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