International Patent: END-TO-END MAPPING OF NEAR-FIELD INTERACTION PATTERNS VIA PHYSICS-AWARE NEURAL NETWORK AND PLASMON-ASSISTED NEAR-FIELD STRUCTURED ILLUMINATION

GENEVA, Aug. 7 -- FUTUREWEI TECHNOLOGIES, INC. filed a patent application (US2025/060158) for “END-TO-END MAPPING OF NEAR-FIELD INTERACTION PATTERNS VIA PHYSICS-AWARE NEURAL NETWORK AND PLASMON-ASSISTED NEAR-FIELD STRUCTURED ILLUMINATION”. With publication no. WO/2026/073291, here are the other details related to the patent application:

Kind: Later publication of international search report [A3]

IPC: G02B 21/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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