International Patent: ENCAPSULATING APPARATUSES FOR USE WITH WELDING SYSTEMS AND PROCESSES

GENEVA, July 1 -- EDISON WELDING INSTITUTE, INC filed a patent application (US2025/058555) for “ENCAPSULATING APPARATUSES FOR USE WITH WELDING SYSTEMS AND PROCESSES”. With publication no. WO/2026/128352, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: B23K 9/16

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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