International Patent: EMBEDDING NEURAL NETWORK ON SILICON THROUGH DIE-TO-DIE INTERCONNECT

GENEVA, June 19 -- INTEL CORPORATION filed a patent application (US2025/049640) for “EMBEDDING NEURAL NETWORK ON SILICON THROUGH DIE-TO-DIE INTERCONNECT”. With publication no. WO/2026/106732, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10B 80/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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