GENEVA, Nov. 6 -- INTERNATIONAL BUSINESS MACHINES CORPORATION filed a patent application (EP2026/061057) for “EMBEDDED INTERCONNECTS IN SEMICONDUCTOR STRUCTURES”. With publication no. WO/2026/229118, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10D 84/01
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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