GENEVA, May 19 -- ELEPHANTECH INC. (4-3-8, Hatchobori, Chuo-ku, Tokyo1040032), エレファンテック株式会社 (東京都中央区八丁堀四丁目３番８号) filed a patent application (PCT/JP2025/038622) for "CIRCUIT FORMATION SUBSTRATE AND METHOD FOR MANUFACTURING CIRCUIT FORMATION SUBSTRATE" on Nov 04, 2025. With publication no. WO/2026/100552, the details related to the patent application was published on May 15, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (W...