GENEVA, July 31 -- TECHNISCHE UNIVERSITEIT EINDHOVEN filed a patent application (IB2026/050658) for “ELECTROWETTING-ON-DIELECTRIC APPARATUS WITH 3D EMBEDDED ELECTRODE, MICROFLUIDIC CHIP AND METHODS OF MANUFACTURING”. With publication no. WO/2026/159670, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B01L 3/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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