GENEVA, Aug. 21 -- SCHAEFFLER TECHNOLOGIES AG & CO. KG filed a patent application (DE2026/100169) for “ELECTRONIC MODULE, MOUNTING MODULE AND MOUNTING METHOD”. With publication no. WO/2026/171329, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H02K 3/46
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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