International Patent: ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE

GENEVA, July 27 -- SAMSUNG ELECTRONICS CO., LTD. filed a patent application (KR2026/000926) for “ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE”. With publication no. WO/2026/155568, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G06F 1/20

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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