GENEVA, Sept. 18 -- SAMSUNG ELECTRONICS CO., LTD. filed a patent application (KR2026/003467) for “ELECTRONIC DEVICE INCLUDING ELECTRICAL CONNECTION STRUCTURE”. With publication no. WO/2026/187147, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01Q 1/24
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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