International Patent: ELECTRONIC DEVICE COMPRISING STRUCTURE FOR PREVENTING OVERFLOW OF HEAT TRANSFER MATERIAL OF STACKED SUBSTRATE

GENEVA, Oct. 5 -- SAMSUNG ELECTRONICS CO., LTD. filed a patent application (KR2026/003503) for “ELECTRONIC DEVICE COMPRISING STRUCTURE FOR PREVENTING OVERFLOW OF HEAT TRANSFER MATERIAL OF STACKED SUBSTRATE”. With publication no. WO/2026/205817, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H05K 1/14

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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