GENEVA, Sept. 7 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2025/110630) for “ELECTRONIC DEVICE, CIRCUIT BOARD ASSEMBLY, CHIP PACKAGING STRUCTURE, SUBSTRATE AND MANUFACTURING METHOD”. With publication no. WO/2026/179057, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 21/48
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....