GENEVA, June 26 -- EEJA LTD. filed a patent application (JP2025/028805) for “ELECTROLYTIC SILVER-GERMANIUM ALLOY PLATING SOLUTION, REPLENISHING SOLUTION FOR ELECTROLYTIC SILVER-GERMANIUM ALLOY PLATING SOLUTION, ELECTROLYTIC SILVER-GERMANIUM ALLOY PLATING METHOD, SILVER-GERMANIUM ALLOY PLATING FILM, AND ELECTRICAL CONTACT MATERIAL”. With publication no. WO/2026/120861, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C25D 3/64
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....