International Patent: ELECTROLESS NICKEL PLATING PROCESS FOR COPPER OR COPPER ALLOY COMPONENTS

GENEVA, Sept. 7 -- MICRON S.R.L. filed a patent application (IB2025/052053) for “ELECTROLESS NICKEL PLATING PROCESS FOR COPPER OR COPPER ALLOY COMPONENTS”. With publication no. WO/2026/180842, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C23C 18/16

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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