GENEVA, July 27 -- SEKISUI CHEMICAL CO., LTD. filed a patent application (JP2026/000898) for “ELECTROCONDUCTIVE PASTE, RFID INLAY, AND METHOD FOR PRODUCING RFID INLAY”. With publication no. WO/2026/155163, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01B 1/22
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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