GENEVA, June 26 -- THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY filed a patent application (IB2025/000561) for “ELECTRO-STIMULATIVE, HYDROPHILIC-HYDROPHOBIC DUAL-STRUCTURED METALLIC MESH WOUND DRESSING”. With publication no. WO/2026/083126, here are the other details related to the patent application:
Kind: Later publication of international search report [A3]
IPC: A61F 13/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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