GENEVA, Oct. 5 -- NITTO DENKO CORPORATION filed a patent application (JP2026/012928) for “ELECTRICALLY PEELABLE ADHESIVE COMPOSITION, ELECTRICALLY PEELABLE ADHESIVE LAYER, ADHESIVE SHEET, AND JOINED BODY”. With publication no. WO/2026/205550, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C09J 133/06
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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