GENEVA, June 24 -- SIKA TECHNOLOGY AG filed a patent application (EP2025/083660) for “ELECTRICALLY CONDUCTIVE EPOXY RESIN COATING CONTAINING CARBON NANOTUBES AND ELECTROSTATICALLY DISSIPATIVE FLOOR”. With publication no. WO/2026/114727, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C09D 5/24
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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