International Patent: ELECTRICALLY CONDUCTIVE BONDING MATERIAL AND SEMICONDUCTOR DEVICE MADE THEREFROM

GENEVA, Sept. 24 -- HENKEL AG & CO. KGAA filed a patent application (CN2025/084027) for “ELECTRICALLY CONDUCTIVE BONDING MATERIAL AND SEMICONDUCTOR DEVICE MADE THEREFROM”. With publication no. WO/2026/193895, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C09J 7/30

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Disclaimer: Curated by HT Syndication....