GENEVA, Sept. 18 -- YAZAKI NORTH AMERICA, INC. filed a patent application (US2026/018381) for “ELECTRICAL CONNECTION SYSTEM INCLUDING SHIELD AND MATING COMPONENT WITH CONTACTS AND METHOD FOR FORCE AND GROUNDING DISTRIBUTION”. With publication no. WO/2026/188248, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01R 13/6597

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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