GENEVA, April 13 -- DYSON TECHNOLOGY LIMITED (Tetbury HillMalmesbury Wiltshire SN16 0RP) filed a patent application (PCT/IB2025/059877) for "AIRFLOW ASSEMBLY" on Oct 01, 2025. With publication no. WO/2026/074456, the details related to the patent application was published on Apr 09, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): AITCHISON, Andrew (c/o Dyson Technology LimitedTetbury HillMalmesbury Wiltshire SN16 0RP)
Abstract: An airflow assembly is provided. The airflow assembly comprises a body comprising an air inlet through, a first body section and a second body section. The first bod...