GENEVA, Sept. 7 -- INTERNATIONAL BUSINESS MACHINES CORPORATION filed a patent application (IB2026/051212) for “DYNAMICALLY CREATED DIES FOR THREE-DIMENSIONAL (3D) PRINTING”. With publication no. WO/2026/180890, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B29C 64/106
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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