International Patent: DUAL MANIFOLD DIE HAVING A CONFIGURATION TO CONTROL INTRODUCTION OF ADDITIONAL MATERIAL AND PROCESS OF IMPLEMENTING THE SAME

GENEVA, Sept. 18 -- NORDSON CORPORATION filed a patent application (US2026/017414) for “DUAL MANIFOLD DIE HAVING A CONFIGURATION TO CONTROL INTRODUCTION OF ADDITIONAL MATERIAL AND PROCESS OF IMPLEMENTING THE SAME”. With publication no. WO/2026/187732, here are the other details related to the patent application:

Kind: Initial Publication without ISR [A2]

IPC: B29C 48/08

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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