International Patent: DRY PLANARIZATION AND POLISHING OF DIAMOND WAFERS USING MULTI-STAGE PLASMA ETCHING

GENEVA, Sept. 24 -- ADVANCED DIAMOND HOLDINGS, LLC filed a patent application (US2026/019558) for “DRY PLANARIZATION AND POLISHING OF DIAMOND WAFERS USING MULTI-STAGE PLASMA ETCHING”. With publication no. WO/2026/198547, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10P 50/28

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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