GENEVA, July 27 -- NITTO DENKO CORPORATION filed a patent application (JP2026/000259) for “DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET, JOINED BODY, ELECTRICAL/ELECTRONIC APPLIANCE, AND METHOD FOR PRODUCING PRESSURE-SENSITIVE ADHESIVE SHEET”. With publication no. WO/2026/155040, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C09J 7/38
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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