GENEVA, March 22 -- DONGSHENG CHEMICAL (SHANGHAI) CO., LTD (No.1728, Cangong RoadFengxian District, Shanghai 201417), 东胜化学（上海）有限公司 (中国上海市奉贤区苍工路1728号) filed a patent application (PCT/CN2025/098234) for "SOLDER RESIST INK RESIN FOR FOLDABLE MULTILAYER CIRCUIT BOARD" on May 30, 2025. With publication no. WO/2026/056357, the details related to the patent application was published on Mar 19, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inven...