INTERNATIONAL PATENT: DIODES INCORPORATED FILES APPLICATION FOR "POWER SEMICONDUCTOR APPARATUS AND BONDING METHOD THEREOF"

GENEVA, March 24 -- DIODES INCORPORATED (4949 Hedgcoxe Road, Suite 200Plano, Texas 75024) filed a patent application (PCT/US2024/051916) for "POWER SEMICONDUCTOR APPARATUS AND BONDING METHOD THEREOF" on Oct 18, 2024. With publication no. WO/2026/059584, the details related to the patent application was published on Mar 19, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WILCOXEN, Duane (7704 Kilbride CircleDallas, Texas 75248)

Abstract: An apparatus includes a backside supporting layer having a first thickness, an adhesive layer over the backside supporting layer, a metal layer over the adh...