International Patent: DIE-TO-DIE BYPASS MODE FOR CHIPLET INITIALIZATION, CONFIGURATION, AND COMMUNICATION

GENEVA, Aug. 7 -- MICROSOFT TECHNOLOGY LICENSING, LLC filed a patent application (US2025/057573) for “DIE-TO-DIE BYPASS MODE FOR CHIPLET INITIALIZATION, CONFIGURATION, AND COMMUNICATION”. With publication no. WO/2026/164731, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G01R 31/3185

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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